Impact resistant back bumper is designed for tough shock absorption and aids against accidental drops, bumps, and scratches for improved protection.
Anti-Cling Dot Matrix technology prevents watermark or rainbow effect on the back of the device leaving a clear view at all times. Microdot does not alter the appearance of the original look, yet the performance has increased as your device will no longer cling on to the case.
Features tough MIL-STD 810G - 516.6 Certified Military Grade Drop Protection with reinforced inner and outer corner barriers specially crafted to protect from both sides against falls or drops while keeping a slim and sleek profile.
Safeguard the screen confidently when face down with precise tailored lip designed to lift the display safely away from flat surfaces. Built-in QuikCatch lanyard hole allows accessories like wrist straps to secure your phone against accidental drops.
New Fusion-X is the authentic Ringke design with an enhanced style created to provide extended protection for your device. Maintain the crystal clear PC panel with minimal bulk and the durable TPU bumper with tactile grip that gives improved protection.